Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Abstract Double-sided lapping is an precision machining method capable of obtaining high-precision surface. However, during the process thin pure copper substrate, workpiece will be warped due to influence residual stress, including stress and initial which deteriorate flatness ultimately affect performance components. In this study, finite element (FEM) was adopted study effect stress-related on deformation substrate double-sided lapping. Considering workpiece, caused by their distribution characteristics, a prediction model proposed for simulating in measuring material removal rate upper lower surfaces under corresponding parameters. The results showed that primary cause warping redistribution uneven both surfaces. simulation were good agreement with experimental results.